Mochini oa Tlhahlobo o Ikemetseng oa SMT Solder Paste 3D SPI
Setšoantšo sa KY8080
Mosebetsi Ho hanyetsa mocheso o phahameng
Automatic grade Automation
Boholo ba mochini 800 * 1335 * 1627mm
Board Size Single Lane 50×50 - 350×330mm
Dual Lane 50×50 - 350×580mm
Fov Size 36 * 36mm
Matla a 220V,10A
Boima ba Tsela e le 'ngoe: 600kgs
Litsela tse peli: 650kgs
Khatello eohle ea 4-6 bar
Boholo ba ho kenya PCB boholo ba X330*Y350mm
Setifikeiti sa CE. ISO. RoHS
Sephutheloana sa lehong se tloaelehileng sa Transport Package
Litekanyo: bophahamo ba modumo, acreage, bophahamo, XY offset, sebopeho
Ho lemoha Mefuta e sa Etsahaleng e sieo, thini e sa lekaneng, thini e feteletseng, borokho, offset, mal-shapes, tšilafalo ea bokaholimo.
Qeto ea Lense 4.5um/5um/6um/8um/10um/12um/15um/16um/18um/20um
Ho nepahala: XY (Qeto) 20um
Bophahamo bo ka phetoang: ≤1um (3 Sigma); bophahamo ba modumo/acreage:<1%(3 Sigma)
Gage R&R<<10%<br /> Lebelo la Tlhahlobo 0.35sec/FOV-0.5sec/FOV
Nako ea ho Khetholla Mark-point 0.3sec/piece
Maximun Meauring Head ± 550um (± 1200um joalo ka khetho)
Maximun Measuring Height of PCB Warp ±5um
Minimun Pad Spacing 100um
Minimum element 01005/03015/008004 01005/03015/008004
Maximun Loading PCB Size(X*Y) 450x500mm(B) 470x500mm (C) 630x686mm
Thepa ea ho pheta-pheta ho nepahala<10% (5 Sigma)
